The heat band has a high thermal conductivity and insulation, can be firmly connected to the heat sink and IC chip. Simply stick to the surface of an object. Tear the blue paper to stick firmly to the heat source and heat sink.
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THERMAL PASTE GD007. Thermal grease is a material used to fill the voids between the CPU, GPU and the heatsink. GD007 thermal grease is ideal for apply to CPU, VGA and other PC and electronics components.
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Kryonaut uses a special structure, which halts the drying out process at temperatures of up to 80° Celsius. Thermal Conductivity: ★★★★★. Excellent thermal conductivity. Thermal Conductivity Add to Favorites.
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Cooler Master MasterGel Pro V2 High Thermal Conductivity. HIGH THERMAL CONDUCTIVITY – At 9 W/mK. Don’t risks ruining high-end gaming motherboards or graphics cards with generic thermal pastes.
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The high performance thermal pad from Thermal Grizzly. Thermal Grizzly Hydronaut High Performance Thermal Paste Spatula 1.5ml / 3.9g. - High thermal conductivity. MINUS PAD 8 - 100X 100X 1 MM. Minus Pad 8 is based on a ceramic silicon formula and utilises correct compression thicknesses for optimum mounting and heat transfer.
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Am 10.09.2025 hat der Verkäufer die folgenden Angaben hinzugefügt Operation Temperature: -50/280°c. Thermal Conductivity: >3.17W/m. k,Thermal Resistance: <0.067°c-in2/w.
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Silicone Thermal Heatsink ComCooling Paste. This thermal grease can be used on the rear side of the heat sink which has no thermal pad. It will improve the heat dissipation of your processor. HY510 grey thermal grease provides better cooling performance with high thermal conductivity graphite.
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This thermal grease can be used on the rear side of the heat sink which has no thermal pad. Thermal conductivity: 1.829 W/m-k. Thermal resistance: 0.123 C-in2/w. Paste Colour: Grey.
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This thermal grease can be used on the rear side of the heat sink which has no thermal pad. It will improve the heat dissipation of your processor. Paste Colour: Grey. Thermal conductivity: 1.829 W/m-k.
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This thermal grease can be used on the rear side of the heat sink which has no thermal pad. It will improve the heat dissipation of your processor. Paste Colour: Grey. Thermal conductivity: 1.829 W/m-k.
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The CPU and heat sink/fan assembly. - Thermal Conductivity: 3.05W/m. k, Thermal Resistance: 0.073°c-in2/w. 1 1g Thermal grease. You can follow below process to chontact us. All pictures are for illustration purpose only and Colours may vary slightly.
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1x Heatsink Plaster. Computer CPU, GPU (graphics card chip) and radiator filling and heat conduction. Thermal conductivity: 0.671W/m-K. Thermal impedance: 0.06. Good thermal conductivity, strong adhesion.
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HIGH PERFORMANCE: HY610 tends to form a thinner layer between CPU & Heat sink than other greases and even under low pressure -. Plus for it's wide temperature range (-55 ~ 300 c) HY610 is a sensible choice in the use of all dielectric devices and materials.
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The choice of thickness should therefore depend entirely on the gap to be bridged. This enables an ideal surface design with maximum possible compaction. The silicone-based thermal pad has a consistency similar to modeling clay.
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To improve thermal conductivity, better than regular types and good partner for CPU/GPU cooler and other. Thermal Conductivity. Thermal Impedance. Operation Temperature.
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Am 13.08.2025 hat der Verkäufer die folgenden Angaben hinzugefügt Operation Temperature: -50/280°c. Thermal Conductivity: >3.17W/m. k,Thermal Resistance: <0.067°c-in2/w.
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Gewicht: 6,0 g/Tube. Am 14.04.2025 hat der Verkäufer die folgenden Angaben hinzugefügt.
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·1 Jahr kostenloser Reparatur der Geräte. · Einzelteile sollten auf den Kosten Käufer zwecks Reparatur oder Austausch zurückgegeben werden. Am 06.03.2025 hat der Verkäufer die folgenden Angaben hinzugefügt.
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This thermal grease can be used on the rear side of the heat sink which has no thermal pad. It will improve the heat dissipation of your processor. Professional grade thermal paste. Ideal for 360's, Processors, Heat sinks CPU"s GPU"s and other component devices.
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