Even stubborn traces and residues of heat conductive pads can be reliably removed. Arctic Wipes. Arctic MX4. The MX Cleaner dissolves old and heavily dried thermal paste, such as your MX-2 or MX-4, so that it can be picked up and removed with the cloth without any problems.
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Put isopropyl alcohol or acetone on a thermal pad and 10 minutes later you will have a thermal pad. Only with a lot of rubbing and scrubbing will you be able to remove the pad. While the alcohol or acetone may soften the pad, neither actually dissolves the pad.
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ARCTIC's thermal pastes have always been one of the most popular products on the TIM market. The ARCTIC MX-6 is a carbon filler-based thermal paste and reaches its maximum performance without burn-in, directly after application and distribution.
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It is engineered to provide ultra-efficient heat transfer, ensuring optimal cooling performance. Ultimate Heat Conductivity. Thermal Conductivity Add to Favorites. Available in three different sizes.
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This thermal grease can be used on the rear side of the heat sink which has no thermal pad. It will improve the heat dissipation of your processor. Paste Colour: Grey. Thermal conductivity: 1.829 W/m-k.
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The high performance thermal pad from Thermal Grizzly. - High thermal conductivity. Thermal Grizzly Hydronaut High Performance Thermal Paste Spatula 1.5ml / 3.9g. MINUS PAD 8 - 20X 120X 1,0 MM. Minus Pad 8 is based on a ceramic silicon formula and utilises correct compression thicknesses for optimum mounting and heat transfer.
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This thermal grease can be used on the rear side of the heat sink which has no thermal pad. Thermal conductivity: 1.829 W/m-k. Thermal resistance: 0.123 C-in2/w. Paste Colour: Grey.
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Computer's processor to its heat sink to keep your CPU from overheating. which has no thermal pad. It will improve the heat dissipation of your processor. HY510 grey thermal grease provides better cooling performance with high thermal conductivity graphite.
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RoHS, CE, PFOS, REACH compliant with SGS testing report. Thermal Conductivity Thermal Impedance Includes easy to apply syringe. Add to Favorites. There is a separate area to leave a product review if you wish.
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GP Thermal Pad 2mm. Thermal Conductivity (W/mK). Pad size (mm). Available in two thicknesses. This does not affect your statutory rights. We exclude any liability for any errors and omissions on the site.
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1x Heatsink Plaster. Thermal conductivity: 0.671W/m-K. Thermal impedance: 0.06. Good thermal conductivity, strong adhesion. Good viscosity. Good performance. It is a one-component room temperature vulcanized silica gel with good thermal conductivity and insulation.
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This thermal grease can be used on the rear side of the heat sink which has no thermal pad. It will improve the heat dissipation of your processor. Thermal conductivity: 1.829 W/m-k. Thermal resistance: 0.123 C-in2/w.
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Silicone Thermal Heatsink ComCooling Paste. This thermal grease can be used on the rear side of the heat sink which has no thermal pad. It will improve the heat dissipation of your processor. High thermal conductivity.
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The GP-Ultimate 120×20 is designed to provide perfect thermal interface to transfer heat to heatsinks when installed on PCB with height differences and uneven surfaces such as DRAM ICs, VRM ICs, power MOSFETs, NVRAM ICs and other high-temperature SMD components.
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Thermal Grizzly TG Remove is an acetone based nano-cleaner for the best cleaning results of thermal paste. Acetone based nano-cleaner. TG Remove was developed by Thermal Grizzly with the focus on removing thermal paste and residues in the most efficient way.
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·1 Jahr kostenloser Reparatur der Geräte. · Einzelteile sollten auf den Kosten Käufer zwecks Reparatur oder Austausch zurückgegeben werden.
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Aeronaut thermal grease is the ideal beginner's product with high effectiveness. Great surface protection, as well as good heat transfer capabilites make Aeronaut the ideal choice for users who want to optimize their cooling solution in an effective way, or maybe want to use an alternative to the thermal grease included with their hardware, with a remarkable cost effectiveness to boot.
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Like the original Céramique, Céramique 2 uses only ceramic fillers so it is neither electrically conductive nor capacitive. The tri-linear composite of aluminum oxide, zinc oxide and boron nitride allows the thinnest possible bond line with modern processors, heatsinks and electronics.
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