The Thermal Grizzly Minus Pad Pro thermal pads are part of the Basic, Advance, and Pro series. The electrically non-conductive Minus Pad Pro thermal pads are part of the Minus Pad Basic, Advance, and Pro series.
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Kompatibel mit: Desktop. Produktart: Thermal Paste. MAXIMUM COOLING PERFORMANCE: Designed for demanding systems and proven as an accessory for be quiet! Dark Rock high-end air coolers. Marke: be quiet!
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Gelid GP Ultimate Thermal Pads. Hardness (Shore): 60-70 OO. Thermal Conductivity (W/mK): 15. Ultimate Heat Conductivity, 15 W/mK. Size (mm): 90 x 50. This does not affect your statutory rights. We exclude any liability for any errors and omissions on the site.
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The Thermal Pad APT2012 is the ideal, budget-friendly choice for situations that require thermal transmission without needing particularly high performance. ARCTIC thermal pads are non-adhesive and can be precisely positioned.
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Good thermal conductivity, suitable for use in low pressure applications. Thermal Conductivity: Made of thermal silica gel with heat conductivity of 6.0W/Mk. 1 × Thickness 0.5mm Silicone Thermal Pad.
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Ultimate 15 W/mK heat conductivity. Thermal Conductivity 90mm x 50mm x 1mm. We use a variety of different carriers to fulfil orders. Add to Favorites. QUICK LINKS. Lowest Price. Ending Soon.
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The GP-Ultimate 120×20 is designed to provide perfect thermal interface to transfer heat to heatsinks when installed on PCB with height differences and uneven surfaces such as DRAM ICs, VRM ICs, power MOSFETs, NVRAM ICs and other high-temperature SMD components.
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Thermalright HR10 2280 PRO Black SSD Cooler,2280 SSD Heatsink Cooler,Double-Sided Heat Sink,4 Heat p. The R&D product line includes: CPU coolers, case fans, silicone pad, thermal paste, mounting brackets, accessories and other products.
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ARCTIC's Thermal Pads are non-stick and can be easily removed and repositioned. Installation is child's play, making them perfect for beginners. The Thermal Pad based on silicone and a special filler outperforms generic and performance pads by far.
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Thermalright HR10 2280 PRO SSD Cooler,2280 SSD Heatsink Cooler,Double-Sided Heat Sink,4 Heat pipes. The R&D product line includes: CPU coolers, case fans, silicone pad, thermal paste, mounting brackets, accessories and other products.
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Contents: 3 x 1g / 0.5ml (Approx.). - each tube is enough for 1 to 2 applications (Depending on size of heatsink). AMD Duron DHD1600DLV1C 1600MHz / 64KB / 266MHz Socket 462 Processor / CPU. Paste Colour: Silver / Grey.
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The thinner the pad, the lower the thermal resistance. The TP-3 pad with a thickness of 0.5 mm can easily be compressed to 0.3 mm and thus compensate for height differences between various components of up to 0.2 mm.
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Gelid Solutions GP Ultimate 1mm Thick Thermal Pad (90 x 50 x 1.0 mm) W/mK 15. GP Thermal Pad 1mm. GP Thermal Pad 0.5mm. Thermal Conductivity (W/mK). Pad size (mm). Available in two thicknesses. This does not affect your statutory rights.
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Good thermal conductivity, suitable for use in low pressure applications. Thermal Conductivity: Made of thermal silica gel with heat conductivity of 6.0W/Mk. 2 × Thickness 0.5mm Silicone Thermal Pad.
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Even stubborn traces and residues of heat conductive pads can be reliably removed. The MX Cleaner dissolves old and heavily dried thermal paste, such as your MX-2 or MX-4, so that it can be picked up and removed with the cloth without any problems.
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Available in a variety of different sizes and thicknesses. Thermal Conductivity : ★★★★. within the capabilities of Thermal Pads. High thermal conductivity. The easy to process and flexible minus pads are made up of different constituents, based on a ceramic silicon formula complex and nano aluminum oxide.
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The Thermal Grizzly Minus Pad Pro thermal pads are part of the Basic, Advance, and Pro series. The electrically non-conductive Minus Pad Pro thermal pads are part of the Minus Pad Basic, Advance, and Pro series.
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• 80 x 80mm. Product code AK-TT13-80. Peel adhesion 1200gf/1mm. Tickness 0.30mm. Thermal conductivity 0.85 W/m.
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Akasa M.2 SSD Thermal Pad. Thermally conductive M.2 SSD interface pad is versatile and suitable for use between components and their heatsinks. The pad moulds around uneven surfaces and can be cut to size to effectively solve and manage unwanted thermal issues.
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