This thermal grease can be used on the rear side of the heat sink which has no thermal pad. It will improve the heat dissipation of your processor. Professional grade thermal paste. Ideal for 360's, Processors, Heat sinks CPU"s GPU"s and other component devices.
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Minimised resistance and maximised efficiency truly enables you to get more from your cooler. Easy to use. RoHS compliant. Hi-performance heat transfer between the CPU and heatsink. Maximum thermal conductivity, 2.4W/mK.
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The Chill Factor 3 is certainly one of the best products in its class, particularly with regards to the areas of quality and performance. The paste is electrically non-conductive and prevents the possibility of accidentally causing an electrical short circuit, which can destroy valuable computer components.
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Noctun NA-SCW1 Thermal Cleaning Wipes. Thermal Conductivity Easy to Apply. Add to Favorites. Easy to apply. There is a separate area to leave a product review if you wish. Safe Application. We use a variety of different carriers to fulfil orders.
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With good quality and good conduction. It can easily used on IC, heatsink. Material: Conduction Silicone. Feel free to give us a ring! Thickness: 3.5mm.
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Noctun NA-SCW1 Thermal Cleaning Wipes. Thermal Conductivity Easy to Apply. Add to Favorites. Easy to apply. There is a separate area to leave a product review if you wish. Safe Application. We use a variety of different carriers to fulfil orders.
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Gelid Solutions GP Ultimate 0.5mm Thick Thermal Pad (90 x 50 x 0.5 mm) W/mK 15. Gelid Solutions GP Ultimate 1mm Thick Thermal Pad (90 x 50 x 1.0 mm) W/mK 15. GP Thermal Pad 1mm. GP Thermal Pad 0.5mm. Thermal Conductivity (W/mK).
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Now, the first product lines are completed, which are also the highest demands of the manufacturer and the overclocking community justice. The choice of thickness should depend only on the gap to be bridged here so.
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2 x Gelid Solutions GP Ultimate 3mm Thick Thermal Pads 90 x 50 x 3.0 mm W/mK 15. 2 x Gelid Solutions GP Ultimate 1mm Thick Thermal Pads 90 x 50 x 1.0 mm W/mK 15. 2 x Gelid Solutions GP Ultimate 1.5mm Thermal Pads 90 x 50 x 1.5 mm W/mK 15.
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It ensures that the heat generated by the CPU or GPU is effectively dissipated. Once applied, it provides a long-lasting solution, remaining effective for a minimum of 6 years, eliminating the need for frequent reapplication.
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1x Heatsink Plaster. Computer CPU, GPU (graphics card chip) and radiator filling and heat conduction. Thermal conductivity: 0.671W/m-K. Thermal impedance: 0.06. Good thermal conductivity, strong adhesion.
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GP Thermal Pad 2mm. Thermal Conductivity (W/mK). Pad size (mm). Available in two thicknesses. This does not affect your statutory rights. We exclude any liability for any errors and omissions on the site.
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This thermal grease can be used on the rear side of the heat sinkwhich has no thermal pad. It will improve the heat dissipation of your processo. Professional grade thermal paste. Thermal conductivity: >1.829 W/m-k.
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THERMAL PASTE GD007. Thermal grease is a material used to fill the voids between the CPU, GPU and the heatsink. GD007 thermal grease is ideal for apply to CPU, VGA and other PC and electronics components.
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Model : STARS-922. OLED LED&RGB. Am 13.01.2026 hat der Verkäufer die folgenden Angaben hinzugefügt Thermal conductivity : >0.671 W/m-k. Thermal resistance : <0.06 °C-in2/W. Use for : North-south bridge video card heat dissipation part.
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It's low viscosity allows it to be spread more easily and thinly for optimal efficiency. Features Ultimate Heat Conductivity Non-Electrical Conductive Non-Corrosive, Non-Curing and Non-Toxic No Bleeding and user friendly GELID Applicator Supplied Specifications Density (g/cm3) 3.73 Thermal conductivity (W/mK) 8.5 Viscosity (Centipoise) 85000 Net Content 10g.
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This thermal grease can be used on the rear side of the heat sink which has no thermal pad. It will improve the heat dissipation of your processor. Professional grade thermal paste. Ideal for 360's, Processors, Heat sinks CPU"s GPU"s and other component devices.
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Net Weight: 20g. 1x Silver thermal grease paste. Suitable for: CPU heatsink or chip. High temperature resistance. Am 13.01.2026 hat der Verkäufer die folgenden Angaben hinzugefügt Thermal Resistance: <0.067°C-in2/W.
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CryoFuze 5 highlights. Low thermal impedance. - Better thermal performance with low heat resistance. - Electrically insulated composition provides excellent adhesion. - Easy to use and clean. Powerful Exceptional thermal conductivity for high performance systems.
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