Wir werden Ihre Nachricht innerhalb von 48 Stunden antworten. 1 x BGA Reballing Station with Handles(90 90mm). One reballing station can be used with different stencils. Can correspond to BGA of different sizes, maximum chip size is 50 50mm.
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Reballing Station Size: 6.7 x 1.5 x 2.7cm/2.64 x 0.59 x 1.06in. 1 x Reballing Station. Universal type, use 0.45mm solder balls. Quantity: 1 Set. Made of high quality material, solid, durable and good performance, long service life.
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Die Schablone ist direkt erhitzbar. This is a direct heating stencil. Reparaturen Smartphone. Reparaturen Notebooks. Notebook Ersatzteile / Parts. FFC / Flexkabel.
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BGA Reballing Stencil only, other accessories in the picture is not included! These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC. Item Type: BGA Reballing Stencil.
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Set: 56 Direkt erhitzbare BGA-Schablonen (NVidia, VIA, ATI, XBOX, Universal und andere). BGA Reballing and Reflowing:Solder Balls ,Stencils andFlux. Set: 56 Direct Heating BGA Stencils (NVidia, VIA, ATI, XBOX, Universal and others).
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BGA Silikon Pad Isolierung Matte Universal BGA Schablone Magnetische Basis für CPU IC Chip Löten BGA Reballing Matte Werkzeuge Sets
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BGA-Reballing-Kit 90 x 90 mm BGA-Reballing-Station mit Handschaft
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3pcs Universal BGA Reballing Stencils Kit For MTK Samsung HTC Huawei Android 100% brand new and high quality Features: Suitable for MTK Samsung HTC Huawei Android Material: Stainless steel Color: Silver Quantity: 3 Pcs/set Package includes: 3 x Universal BGA Reballing Stencils (without retail package)
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Suitable for all kinds of IC, BGA rework kit. High-precision BGA universal stencils can be heat directly. Item Type: BGA Planting Station Kits. 1 Set x BGA Planting Platform Kits. Due to the difference between different monitors, the picture may not reflect the actual color of the item.
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Size: 90x90mm/3.5x3.5in. Quantity: 10pcs/set, 27pcs/set(Optional). Each set of 10/27 pieces. Basically covers the current common BGA chip. Universal Stencils only, other accessories demo in the picture is not included!
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Schablone ist einfach zu bedienen und effizienter zu arbeiten. Ausgezeichnet, um Ihre alte beschädigte zu ersetzen. Kompatible Modelle für iPhone 6 S IC Reparatur.
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Prompt the stencil more durable, easier to get off the net, more efficient, and ensure the soldering performance in the process of planting tin. Combined with the repair man lphone special solder paste planting full of tin, no need to weld, accurate positioning.
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2BV3-0001 SC 560002 MVF92 BGA Reballing Station für Auto Automotive IC Chip BGA Reballing Schablonen
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Suitable for all kinds of IC, BGA rework kit. High-precision BGA universal stencils can be heat directly. Item Type: BGA Planting Station Kits. 1 Set x BGA Planting Platform Kits. Due to the difference between different monitors, the picture may not reflect the actual color of the item.
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BGA Reballing Stencil only, other accessories in the picture is not included! These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC. Item Type: BGA Reballing Stencil.
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Made of imported stainless steel plate. Good stencil thickness. 36 x Graphics Card Stencils. Material: Steel. Item Type: Graphics Card Stencils. Quantity: 36pcs/set.
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Item: SAM13 BGA Reballing Stencil für samsung. 1pcs BGA -Schablone. Am 21.02.2025 hat der Verkäufer die folgenden Angaben hinzugefügt.
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I can provide a large number of spare parts for old PCs.
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3D BGA IC Reballing Stencil For A10. Stepped groove design enables this stencil to align with tinning position of IC rapidly. This 3D planting stencil is thicker than ordinary stencils in the market.
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110 stücke bga reballing direkt heizen schablonen löt pasten kugeln bga reballing kit für smt smdrework reparatur
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BGA Löt Stencil zum Reballing von iPhone Displays 11 - 14. Perfekt geeignet zum Reballing von iPhone Displays. Kompatibel mit iPhone 11 - iPhone 14 Pro Max. Rufen Sie uns an. Für tägliche Nutzung geeignet.
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Series-4: Samsung A520/A310/S5mini Universal A7/A5/A3/S5/J3 Series. Series-7Samsung S9/S9+. Series-12: Samsung S20 G988U/G988B/BR. Series-1: Samsung S8/S8+/NOTE8 Series G9500/G955U/N9500. Prompt the stencil more durable, easier to get off the net, more efficient, and ensure the soldering performance in the process of planting tin.
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MI13 BGA Reballing Stencil For Xiaomi Redmi 9 Note9 CPU PM6350 PM4250 SM7225 MT6769V MT6358VW PM7250B WCN3991 77040 78190 PA IC. Before buying, you should consider 3 points You might also like.
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1 x Phone Tin Reballing Stencil. Applicable Models: Suitable for A33 A53 A536 A13 A21S F13 M33, etc. Schnelle Zinnbeschichtungsgeschwindigkeit: Unser Zinn -Neuballe -Schablone ändert sich nicht unter hoher Temperatur und schneller Zinnbeschichtungsgeschwindigkeit, so dass die Effizienz der Zinnbeschichtung verbessert werden kann.
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YCS BGA Silikon Pad Isoliermatte Universal BGA Schablone Magnetfuß für CPU IC Chip Löten BGA Reballing Werkzeuge
Aliexpress DE