Titel: AI Engineering | Zusatz: Building Applications with Foundation Models | Medium: Taschenbuch | Autor: Chip Huyen | Einband: Kartoniert / Broschiert | Inhalt: Einband - flex.(Paperback) | Sprache: Englisch | Seiten: 509 | Maße: 231 x 178 x 31 mm | Erschienen: 28.02.2025 | Anbieter: Buchbär.
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Recent breakthroughs in AI have not only increased demand for AI products, they've also lowered the barriers to entry for those who want to build AI products. Everyone, including those with minimal or no prior AI experience, can now leverage AI models to build applications.
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Titel: AI Engineering | Zusatz: Building Applications with Foundation Models | Medium: Taschenbuch | Autor: Chip Huyen | Einband: Kartoniert / Broschiert | Inhalt: Einband - flex.(Paperback) | Sprache: Englisch | Seiten: 509 | Maße: 231 x 178 x 31 mm | Erschienen: 28.02.2025 | Anbieter: preigu.
eBay
Recent breakthroughs in AI have not only increased demand for AI products, they've also lowered the barriers to entry for those who want to build AI products. Everyone, including those with minimal or no prior AI experience, can now leverage AI models to build applications.
eBay
Recent breakthroughs in AI have not only increased demand for AI products, they've also lowered the barriers to entry for those who want to build AI products. Everyone, including those with minimal or no prior AI experience, can now leverage AI models to build applications.
eBay
Recent breakthroughs in AI have not only increased demand for AI products, they've also lowered the barriers to entry for those who want to build AI products. Everyone, including those with minimal or no prior AI experience, can now leverage AI models to build applications.
eBay
Titel: AI Engineering | Zusatz: Building Applications with Foundation Models | Medium: Taschenbuch | Autor: Chip Huyen | Einband: Kartoniert / Broschiert | Inhalt: Einband - flex.(Paperback) | Sprache: Englisch | Seiten: 509 | Maße: 231 x 178 x 31 mm | Erschienen: 28.02.2025 | Anbieter: Cellestria.
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Titel: AI Engineering | Zusatz: Building Applications with Foundation Models | Medium: Taschenbuch | Autor: Chip Huyen | Einband: Kartoniert / Broschiert | Inhalt: Einband - flex.(Paperback) | Sprache: Englisch | Seiten: 509 | Maße: 231 x 178 x 31 mm | Erschienen: 28.02.2025 | Anbieter: MEOVERSA.
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Titel: AI Engineering | Zusatz: Building Applications with Foundation Models | Medium: Taschenbuch | Autor: Chip Huyen | Einband: Kartoniert / Broschiert | Inhalt: Einband - flex.(Paperback) | Sprache: Englisch | Seiten: 509 | Maße: 231 x 178 x 31 mm | Erschienen: 28.02.2025 | Anbieter: Anja's.
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